Hochpräzision Halbleiterverpackungsgeräte LED-Bindmaschine

Adresse: 301A, Bldg. D, Nr. 50, Nanhuan Road, Shiwei Community, Matian Street, Guangming District, Shenzhen, Guangdong, China
Telefon: 86-18823383970-8:30-17:30
Fax: 86-18823383970
E-Mail: wenzhanhucai@163.com
Arbeitszeit: 8:30-17:30

Name: Hochpräzision Halbleiterverpackungsgeräte LED-Bindmaschine
Uploaded: 2026-02-07CST01:59:28-06:00
Duration: 38 s
Description: Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.

Gruppe: Andere Videos

Freigabezeit: 2025-04-24

Stichwort: SMT-Linienausrüstung

Videobeschreibung

Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.